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This commit backports patch from community to improve install driver
script:
* if the driver source directory (${_src_full}) have
more than 1 driver file, the script will be failed.
([ ! -f file*.zip ] can match only one file).
Signed-off-by: Ronan Le Martret <ronan.lemartret@iot.bzh>
Signed-off-by: Khang Nguyen <khang.nguyen.xv@rvc.renesas.com>
Signed-off-by: Takamitsu Honda <takamitsu.honda.pv@renesas.com>
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This commit updates MD5SUM for new ADSP packages.
Signed-off-by: Khang Nguyen <khang.nguyen.xv@rvc.renesas.com>
Signed-off-by: Takamitsu Honda <takamitsu.honda.pv@renesas.com>
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This commit updates MD5SUM for new CMS packages.
Signed-off-by: Khang Nguyen <khang.nguyen.xv@rvc.renesas.com>
Signed-off-by: Takamitsu Honda <takamitsu.honda.pv@renesas.com>
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This commit updates MD5SUM for new OMX audio packages.
Signed-off-by: Khang Nguyen <khang.nguyen.xv@rvc.renesas.com>
Signed-off-by: Takamitsu Honda <takamitsu.honda.pv@renesas.com>
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This commit updates MD5SUM for new OMX video packages.
Signed-off-by: Khang Nguyen <khang.nguyen.xv@rvc.renesas.com>
Signed-off-by: Takamitsu Honda <takamitsu.honda.pv@renesas.com>
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From Yv3.7.0, there are 03 options to build u-boot/IPL for H3:
- For R-Car H3 SiP DDR 8GiB (2GiB x 4ch) [1]
- For R-Car H3 SiP DDR 4GiB (2GiB x 2ch) [2]
- For R-Car H3 SiP DDR 4GiB (1GiB x 4ch) [3]
This commit adds a variable into sample configurations to control the
build option:
- For [1]: H3_OPTION = "1" (default)
- For [2]: H3_OPTION = "2"
- For [3]: H3_OPTION = "0"
It also adds H3_OPTION = "0" for H3ULCB by default.
Signed-off-by: Khang Nguyen <khang.nguyen.xv@rvc.renesas.com>
Signed-off-by: Thuy Tran <thuy.tran.xh@rvc.renesas.com>
Signed-off-by: Takamitsu Honda <takamitsu.honda.pv@renesas.com>
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meta-openembedded/meta-networking and meta-openembedded/meta-python
were removed to avoid build error for GENIVI environment.
Signed-off-by: Khang Nguyen <khang.nguyen.xv@rvc.renesas.com>
Signed-off-by: Takamitsu Honda <takamitsu.honda.pv@renesas.com>
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This commit upgrades Linaro Gcc version to 7.2 for adapting to upstream.
Signed-off-by: Khang Nguyen <khang.nguyen.xv@rvc.renesas.com>
Signed-off-by: Takamitsu Honda <takamitsu.honda.pv@renesas.com>
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This commit updates configurations to adapt to YP v2.4.2.
Signed-off-by: Khang Nguyen <khang.nguyen.xv@rvc.renesas.com>
Signed-off-by: Takamitsu Honda <takamitsu.honda.pv@renesas.com>
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This commit updates MD5SUM for new ADSP packages.
Signed-off-by: Khang Nguyen <khang.nguyen.xv@rvc.renesas.com>
Signed-off-by: Takamitsu Honda <takamitsu.honda.pv@renesas.com>
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This commit updates MD5SUM for new CMS packages.
Signed-off-by: Khang Nguyen <khang.nguyen.xv@rvc.renesas.com>
Signed-off-by: Takamitsu Honda <takamitsu.honda.pv@renesas.com>
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This commit updates MD5SUM for new OMX video packages.
Signed-off-by: Khang Nguyen <khang.nguyen.xv@rvc.renesas.com>
Signed-off-by: Takamitsu Honda <takamitsu.honda.pv@renesas.com>
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This commit modifies information for the following updates:
- Remove meta-openembedded/meta-networking and
meta-openembedded/meta-python.
- Upgrade Linaro Gcc version to 7.2.
Signed-off-by: Khang Nguyen <khang.nguyen.xv@rvc.renesas.com>
Signed-off-by: Takamitsu Honda <takamitsu.honda.pv@renesas.com>
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This commit updates the tarball names in copyscripts for new graphic
packages.
Signed-off-by: Khang Nguyen <khang.nguyen.xv@rvc.renesas.com>
Signed-off-by: Takamitsu Honda <takamitsu.honda.pv@renesas.com>
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This commit updates MD5SUM values for new ADSP packages.
Signed-off-by: Khang Nguyen <khang.nguyen.xv@rvc.renesas.com>
Signed-off-by: Takamitsu Honda <takamitsu.honda.pv@renesas.com>
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This commit updates MD5SUM values for new CMS packages.
Signed-off-by: Khang Nguyen <khang.nguyen.xv@rvc.renesas.com>
Signed-off-by: Takamitsu Honda <takamitsu.honda.pv@renesas.com>
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This commit updates MD5SUM for new OMX video packages.
Signed-off-by: Khang Nguyen <khang.nguyen.xv@rvc.renesas.com>
Signed-off-by: Takamitsu Honda <takamitsu.honda.pv@renesas.com>
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This commit removes unused evaproprietary packages and their functions
to avoid confusion.
Signed-off-by: Khang Nguyen <khang.nguyen.xv@rvc.renesas.com>
Signed-off-by: Takamitsu Honda <takamitsu.honda.pv@renesas.com>
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This commit updates year of copyright and fix comment typo.
Signed-off-by: Khang Nguyen <khang.nguyen.xv@rvc.renesas.com>
Signed-off-by: Takamitsu Honda <takamitsu.honda.pv@renesas.com>
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This commit removes vp9dec_lib in H3ULCB and M3ULCB configuration.
It helps to reduce the possibility that user got mistake on
enabling VP9.
Signed-off-by: Khang Nguyen <khang.nguyen.xv@rvc.renesas.com>
Signed-off-by: Takamitsu Honda <takamitsu.honda.pv@renesas.com>
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This commit adds sample configurations for E3 board (Ebisu).
Signed-off-by: Khang Nguyen <khang.nguyen.xv@rvc.renesas.com>
Signed-off-by: Takamitsu Honda <takamitsu.honda.pv@renesas.com>
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This commit modifies graphic recipes to support E3 GFX version.
It also updates copyscript to support copying E3 GFX packages.
Signed-off-by: Khang Nguyen <khang.nguyen.xv@rvc.renesas.com>
Signed-off-by: Takamitsu Honda <takamitsu.honda.pv@renesas.com>
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This commit updates MD5SUM values for new ICCOM packages.
Signed-off-by: Khang Nguyen <khang.nguyen.xv@rvc.renesas.com>
Signed-off-by: Takamitsu Honda <takamitsu.honda.pv@renesas.com>
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This commit adds building instructions with Linaro GCC for E3 board.
It also updates information from krogoth to rocko and adds eLinux.org
reference information for R-Car Gen3 board.
Signed-off-by: Khang Nguyen <khang.nguyen.xv@rvc.renesas.com>
Signed-off-by: Takamitsu Honda <takamitsu.honda.pv@renesas.com>
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This commit supports enabling USB 3.0 for Salvator-X board.
To enable it, please uncomment MACHINE_FEATURES_append = " usb3"
in local.conf.
Signed-off-by: Thuy Tran <thuy.tran.xh@rvc.renesas.com>
Signed-off-by: Takamitsu Honda <takamitsu.honda.pv@renesas.com>
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This commit supports enabling CAS features for R-Car Gen3.
To enable it, please uncomment MACHINE_FEATURES_append = " cas"
in local.conf.
Signed-off-by: Thuy Tran <thuy.tran.xh@rvc.renesas.com>
Signed-off-by: Takamitsu Honda <takamitsu.honda.pv@renesas.com>
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This commit modifies sample configurations for Salvator-X and ULCB
to build with YP2.4 rocko.
Signed-off-by: Thuy Tran <thuy.tran.xh@rvc.renesas.com>
Signed-off-by: Takamitsu Honda <takamitsu.honda.pv@renesas.com>
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With YP 2.4, to build LTP packages, libmnl is required.
libmnl is provided by meta-openembedded/meta-networking.
meta-openembedded/meta-networking will request
meta-openembedded/meta-python.
Hence, we need to add 2 layers to bblayers.
Signed-off-by: Thuy Tran <thuy.tran.xh@rvc.renesas.com>
Signed-off-by: Takamitsu Honda <takamitsu.honda.pv@renesas.com>
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This commit updates year of copyright in copyscript.
Signed-off-by: Thuy Tran <thuy.tran.xh@rvc.renesas.com>
Signed-off-by: Takamitsu Honda <takamitsu.honda.pv@renesas.com>
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Crypto packages have been updated.
This commit modifies its name in copyscript.
Signed-off-by: Thuy Tran <thuy.tran.xh@rvc.renesas.com>
Signed-off-by: Takamitsu Honda <takamitsu.honda.pv@renesas.com>
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DTV/DVD packages have been updated.
This commit modifies its name in copyscript.
Signed-off-by: Thuy Tran <thuy.tran.xh@rvc.renesas.com>
Signed-off-by: Takamitsu Honda <takamitsu.honda.pv@renesas.com>
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This commit modifies MD5SUM values in copyscript for CMS new packages.
Signed-off-by: Thuy Tran <thuy.tran.xh@rvc.renesas.com>
Signed-off-by: Takamitsu Honda <takamitsu.honda.pv@renesas.com>
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This commit updates MD5SUM values for OMX Video/Audio packages.
Signed-off-by: Thuy Tran <thuy.tran.xh@rvc.renesas.com>
Signed-off-by: Takamitsu Honda <takamitsu.honda.pv@renesas.com>
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This commit updates MD5SUM values for ADSP packages to latest release.
Signed-off-by: Thuy Tran <thuy.tran.xh@rvc.renesas.com>
Signed-off-by: Takamitsu Honda <takamitsu.honda.pv@renesas.com>
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This commit modifies recipes and copyscript to update GFX new package
names of this release.
Signed-off-by: Thuy Tran <thuy.tran.xh@rvc.renesas.com>
Signed-off-by: Takamitsu Honda <takamitsu.honda.pv@renesas.com>
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ICCOM new packages have been released.
This patch updates MD5 values for ICCOM packages
Signed-off-by: Thuy Tran <thuy.tran.xh@rvc.renesas.com>
Signed-off-by: Takamitsu Honda <takamitsu.honda.pv@renesas.com>
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This commit modifies copyscript to skip Video and Audio packages
availability check for DTV/DVD pkgs.
Signed-off-by: Thuy Tran <thuy.tran.xh@rvc.renesas.com>
Signed-off-by: Takamitsu Honda <takamitsu.honda.pv@renesas.com>
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This commit updates SOC_FAMILY for M3N to build with supported
environments (MMP, GFX, BSP).
Signed-off-by: Thuy Tran <thuy.tran.xh@rvc.renesas.com>
Signed-off-by: Takamitsu Honda <takamitsu.honda.pv@renesas.com>
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This commit modifies graphic recipes to support M3N GFX version.
It also updates copyscript to support copying M3N GFX packages.
Signed-off-by: Thuy Tran <thuy.tran.xh@rvc.renesas.com>
Signed-off-by: Takamitsu Honda <takamitsu.honda.pv@renesas.com>
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This commit adds building instructions with Linaro GCC for M3N board.
It also adds meta-linaro/meta-optee as a necessary layer
to build Renesas BSP with Linaro GCC.
Signed-off-by: Thuy Tran <thuy.tran.xh@rvc.renesas.com>
Signed-off-by: Takamitsu Honda <takamitsu.honda.pv@renesas.com>
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This commit adds libegl recipe which provides build dependencies on
virtual/egl.
Signed-off-by: Thuy Tran <thuy.tran.xh@rvc.renesas.com>
Signed-off-by: Thao Nguyen <thao.nguyen.yb@renesas.com>
Signed-off-by: Takamitsu Honda <takamitsu.honda.pv@renesas.com>
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This commit updates lib version in cms-user-module recipe and
md5sum in copyscript corresponding to CMS v1.0.0.
Signed-off-by: Thao Nguyen <thao.nguyen.yb@renesas.com>
Signed-off-by: Takamitsu Honda <takamitsu.honda.pv@renesas.com>
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New ADSP packages are updated Interface/Framework to
modify some comments.
Signed-off-by: Thao Nguyen <thao.nguyen.yb@renesas.com>
Signed-off-by: Takamitsu Honda <takamitsu.honda.pv@renesas.com>
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This commit updates md5sum values for Audio packages corresponding
to final release.
Signed-off-by: Thao Nguyen <thao.nguyen.yb@renesas.com>
Signed-off-by: Takamitsu Honda <takamitsu.honda.pv@renesas.com>
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This commit changes md5sum values corresponding to
Video codec final release (Ver.3.0.10).
Signed-off-by: Thao Nguyen <thao.nguyen.yb@renesas.com>
Signed-off-by: Takamitsu Honda <takamitsu.honda.pv@renesas.com>
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This commit updates md5sum values for ICCOM pkgs
corresponding to ICCOM v1.0.1.
Signed-off-by: Thao Nguyen <thao.nguyen.yb@renesas.com>
Signed-off-by: Takamitsu Honda <takamitsu.honda.pv@renesas.com>
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The SOC_FAMILY is already different between H3ULCB and M3ULCB:
H3ULCB uses SoC r8a7795.
M3ULCB uses SoC r8a7796.
Hence, setting this value in h3ulcb.conf and m3ulcb.conf to allow
images to be built without setting SOC_FAMILY in local.conf.
Signed-off-by: Thao Nguyen <thao.nguyen.yb@renesas.com>
Signed-off-by: Takamitsu Honda <takamitsu.honda.pv@renesas.com>
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The ADSP packages have been updated for following fixes:
- TDM Renderer framesize.
- EQZ->RDR.
- DMAC STAGE.
- SSI Setting.
- ADMAC Channel Swap.
- PDMA/ADMAC busy check.
- SRC busy check.
- SSI busy check.
Documents are also updated.
Signed-off-by: Thao Nguyen <thao.nguyen.yb@renesas.com>
Signed-off-by: Takamitsu Honda <takamitsu.honda.pv@renesas.com>
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New ICCOM pkgs have been released.
This patch updates MD5 values for ICCOM pkgs from v0.9.0 to v1.0.0.
Signed-off-by: Thao Nguyen <thao.nguyen.yb@renesas.com>
Signed-off-by: Takamitsu Honda <takamitsu.honda.pv@renesas.com>
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This commit updates ClickThrough copyscript to work with ZIP archive,
which is downloaded directly from URL, instead of tarball.
Change-Id: Idb3de7922d2445d8efe7934b0b9b37796607c528
Signed-off-by: Vladimir Barinov <vladimir.barinov@cogentembedded.com>
Signed-off-by: Takamitsu Honda <takamitsu.honda.pv@renesas.com>
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