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authorTadao Tanikawa <tanikawa.tadao@jp.panasonic.com>2015-08-31 13:31:19 +0900
committerTadao Tanikawa <tanikawa.tadao@jp.panasonic.com>2015-08-31 17:59:03 +0900
commit3fb0bff8c1fc1f4f0a18afeae67e88bdff7582f2 (patch)
treece866aae6bc9f481cab2d436c731db247c2e12ca /README
parent13a2551505942808752a1721c9a27ce7d35cec33 (diff)
parente3b0f456ba8176253cf0d289a14bf26b1ea2134a (diff)
[AGL] Merge branch 'genivi-7.0-bsp-1.8.0' into agl-1.0-bsp-1.8.0
Change-Id: Ib6f42400e99ec1a95cdf139d31fb18ea1ba3314e Signed-off-by: Tadao Tanikawa <tanikawa.tadao@jp.panasonic.com>
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@@ -3,7 +3,7 @@ OpenEmbedded/Yocto BSP layer for Renesas Electronics's SoCs
This layer provides support for Renesas Electronics's platforms for use with
OpenEmbedded and/or Yocto.
-Layer maintainers: Nobuhiro Iwamatsu <nobuhiro.iwamatsu.yj@renesas.com>
+Layer maintainers: Takeshi Saito <takeshi.saito.xv@renesas.com>
Stephen Lawrence <stephen.lawrence@renesas.com> (Genivi branches)
Supported Boards/Machines