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2020-07-16Synopsys,HSDK: Return files for HSDK boardEvgeniy Didin1-0/+1
Lets return HSDK board support as the meta-synopsys layer now is compatible to yocto dunfell. Signed-off-by: Evgeniy Didin <didin@synopsys.com> Change-Id: I3f11b9f8f5790d2513635beb05ec8e7584ebccc4 Reviewed-on: https://gerrit.automotivelinux.org/gerrit/c/AGL/meta-agl/+/25024 Tested-by: Jenkins Job builder account <agl-jobbuilder@automotivelinux.org> ci-image-build: Jenkins Job builder account <agl-jobbuilder@automotivelinux.org> ci-image-boot-test: Jenkins Job builder account <agl-jobbuilder@automotivelinux.org> Reviewed-by: Jan-Simon Moeller <jsmoeller@linuxfoundation.org>
2020-07-07Remove deprecated bsp files from meta-aglJan-Simon Möller1-1/+0
- hsdk does not have a dunfell branch - meta-intel was deprecated in favour of a unified qemux86-64 target - sdcard_image-socfpga is deprecated as upstream changed to use wic Bug-AGL: SPEC-3468 Signed-off-by: Jan-Simon Möller <jsmoeller@linuxfoundation.org> Change-Id: Ie79fc9c379bd6260a18fe6fe0115d9ce8de1017f Reviewed-on: https://gerrit.automotivelinux.org/gerrit/c/AGL/meta-agl/+/24918 Tested-by: Jenkins Job builder account <agl-jobbuilder@automotivelinux.org> ci-image-build: Jenkins Job builder account <agl-jobbuilder@automotivelinux.org> ci-image-boot-test: Jenkins Job builder account <agl-jobbuilder@automotivelinux.org> Reviewed-by: Scott Murray <scott.murray@konsulko.com>
2019-04-26Add ARC HSDK board supportEvgeniy Didin1-0/+1
This changeset adds the necessary files to build image for Synopsys ARC HS Development Kit (HSDK). Most of necessary tunnings are stored in meta-synopys layer. Synopsys DesignWare HSDK (which stands for ARC HS Development Kit) is the latest and greatest development platform that sports quad-core ARC HS38 in real silicon. Most noticeable features of the board are: * Quad-core ARC HS38 CPU running at 1GHz * 4Gb of DDR * Built-in Vivante GPU * Built-in Wi-Fi/Bluetooth module Peripherals: * [micro] SD-card slot * 2 USB 2.0 ports * 1Gbit Ethernet port * Built-in Digilent JTAG probe * Serial port accessible via micro-USB port New feature: SPEC-2346 Change-Id: I8772ee51cc3db9f6549da2d6a5ea2d116586cde6 Signed-off-by: Evgeniy Didin <didin@synopsys.com>
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# OpenEmbedded/Yocto BSP layer for Renesas Electronics's SoCs

This layer provides support for Renesas Electronics's platforms for use with
OpenEmbedded and/or Yocto.

Layer maintainer: Takamitsu Honda <takamitsu.honda.pv@renesas.com>

## Supported Boards/Machines


In addition, this also provides layer which supports boards using Renesas SoCs.
Layer and boards that support is the following:

    meta-rcar-gen3
        - Renesas Electronics Corporation. Salvator-X (R8A7795/R8A7796/R8A77965)
        - Renesas Electronics Corporation. R-Car Starter Kit premier(H3ULCB) (R8A7795)
        - Renesas Electronics Corporation. R-Car Starter Kit pro(M3ULCB) (R8A7796)
        - Renesas Electronics Corporation. R-Car Starter Kit pro(M3NULCB) (R8A77965)
        - Renesas Electronics Corporation. R-Car Ebisu (R8A77990)

Please see README in the layer directory for the description of the board.

## Original BSP image

The meta-renesas layer provides original BSP image. The following:

* core-image-minimal
* core-image-weston